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mpxv7007g rev 0, 05/2005 freescale semiconductor technical data ? freescale semiconductor, inc., 2005. all rights reserved. integrated silicon pressure sensor on-chip signal conditioned, temperature compensated and calibrated the mpxv7007g series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with a/d inputs. this transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. features ? 5.0% maximum error over 0 to 85 c ? ideally suited for microprocessor or microcontroller-based systems ? thermoplastic (pps) surface mount package ? temperature compensated over ?40 to +125 c ? patented silicon shear stress strain gauge ? available in differential and gauge configurations typical applications ? hospital beds ?hvac ? respiratory systems ? process control figure 1. fully integrated pressure sensor schematic ordering information device type options case no. mpx series order no. packing options device marking small outline package (mpxv7007g series) ported elements gauge, axial port, smt 482a mpxv7007gc6u rails mpxv 7007 g gauge, axial port, smt 482a mpxv 7007 gc6t1 tape & reel mpxv 7007 g gauge, side port, smt 1369 mpxv 7007 gp trays mpxv 7007 g gauge, dual port, smt 1351 mpxv 7007 dp trays mpxv 7007 g mpxv7007g series integrated pressure sensor -7 to 7 kpa (-1 to 1 psi) 0.5 to 4.5 v output small outline package pin numbers (1) 1. pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. 1 n/c 5 n/c 2 v s 6 n/c 3 gnd 7 n/c 4 v out 8 n/c mpxv7007dp case 1351-01 mpxv7007gp case 1369-01 small outline package mpxv7007gc6u case 482a-01 sensing element thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry v s v out gnd pins 1 and 5 through 8 are no connects for surface mount package
mpxv7007g sensors 2 freescale semiconductor table 1. maximum ratings (1) 1. exposure beyond the specified limits may cause permanent damage or degradation to the device. rating symbol value unit maximum pressure (p1 > p2) p max 75 kpa storage temperature t stg ?40 to +125 c operating temperature t a ?40 to +125 c table 2. operating characteristics ( v s = 5.0 vdc, t a = 25c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 3 required to meet specification.) characteristic symbol min typ max unit pressure range (1) 1. 1.0 kpa (kilopascal) equals 0.145 psi. p op -7 ? +7 kpa supply voltage (2) 2. device is ratiometric within this specified excitation range. v s 4.75 5.0 5.25 vdc supply current i o ? 7.0 10 madc minimum pressure offset (3) (0 to 85 c) @ v s = 5.0 volts 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. v off 0.33 0.5 0.67 vdc full scale output (4) (0 to 85 c) @ v s = 5.0 volts 4. full scale output (v fso ) is defined as the output voltage at the maximum or full rated pressure. v fso 4.3 4.5 4.7 vdc full scale span (5) (0 to 85 c) @ v s = 5.0 volts 5. full scale span (v fss ) is defined as the algebraic difference between the output vo ltage at full rated pressure and the output voltage at the minimum rated pressure. v fss ?4.0?vdc accuracy (6) (0 to 85 c) 6. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relati onship with pressure over t he specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temper ature range, after the temperature is cy cled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressu re is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pres sure applied, over the temperature range of 0 to 85 c, relative to 25 c. ? variation from nominal: the variation from nominal values, for offset or full scale span, as a percent of v fss , at 25 c. ??? 5.0 %v fss sensitivity v/p ? 286 ?- mv/kpa response time (7) 7. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. t r ?1.0?-ms output source current at full scale output i o+ ?0.1?-madc warm-up time (8) 8. warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. ??20?-ms offset stability (9) 9. offset stability is the product's output deviation when subjecte d to 1000 hours of pulsed pressure, temperature cycling with bias test. ?? 0.5 ?- %v fss
mpxv7007g sensors freescale semiconductor 3 on-chip temperature compensation, ca libration and signal conditioning the performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. figure 2 illustrates the differential or gauge configuration in the basic chip carrier (case 482). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. the mpxv7007g series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. media, other than dry air, may have adverse effects on sensor performance and long-term reliability. contact the factory for information regarding media compatibility in your application. figure 3 shows the recommended decoupling circuit for interfacing the integrated sensor to the a/d input of a microprocessor or microcontroller. proper decoupling of the power supply is recommended. figure 4 shows the sensor output signal relative to pressure input. typical, minimum, and maximum output curves are shown for operation over a temperature range of 0 to 85 c using the decoupling circuit shown in figure 3 . the output will saturate outside of the specified pressure range. figure 2. cross-sectional diagram sop (not to scale) figure 3. recommended power supply decoupling and output filtering (for additional output filtering, please refer to application note an1646.) figure 4. output versus pressure differential fluoro silicone gel die coat wire bond die p1 stainless steel cap thermoplastic case die bond differential sensing element p2 +5 v 1.0 f 0.01 f 470 pf gnd v s v out ips output lead frame differential pressure (kpa) output (v) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 07 typical min max transfer function: v out = v s *(0.057*p+0.5) error v s = 5.0 vdc temp = 0 to 85c -7
mpxv7007g sensors 4 freescale semiconductor nominal transfer value: v out = v s x (0.057 x p + 0.5) (pressure error x temp. factor x 0.057 x v s ) v s = 5.0 v 0.25 vdc transfer function (mpxv7007g) mpxv7007g series temp multiplier ?40 3 0 to 85 1 +125 3 temperature in c 4.0 3.0 2.0 0.0 1.0 ?40 ?20 0 20 40 60 140 120 100 80 temperature error factor note: the temperature multipli er is a linear response from 0 to ?40c and from 85 to 125c. temperature error band pressure error (max) pressure error band - 7 to 7 (kpa) 0.5 (kpa) pressure (kpa) 0.5 0.4 0.2 ?0.3 ?0.4 ?0.5 0 +7 -7 0.3 0.1 ?0.2 ?0.1 pressure error (kpa) 0
mpxv7007g sensors freescale semiconductor 5 pressure (p1)/vacuum (p2) side identification table freescale designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing fluoro silicone gel which protects the die from harsh media. the mpx pressure sensor is designed to operate with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. with the correct footprint, the packages will self align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. figure 5. small outline package footprint part number case type pressure (p1) side identifier mpxv7007gc6u/c6t1 482a side with port attached mpxv7007gp 1369 side with port attached mpxv7007dp 1351 side with part marking 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 8x 2.54 0.300 7.62 inch mm scale 2:1
package dimensions pin 1 identifier h seating plane -t- w c m j k v dim min max min max millimeters inches a 10.54 0.425 0.415 10.79 b 10.54 0.425 0.415 10.79 c 12.70 0.520 0.500 13.21 d 0.96 0.042 0.038 1.07 g 0.100 bsc 2.54 bsc h 0.002 0.010 0.05 0.25 j 0.009 0.011 0.23 0.28 k 0.061 0.071 1.55 1.80 m 0? 7? 0? 7? n 0.444 0.448 11.28 11.38 s 0.709 0.725 18.01 18.41 v 0.245 0.255 6.22 6.48 w 0.115 0.125 2.92 3.17 notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. dimension a and b do not include mold protrusion. 4. maximum mold protrusion 0.15 (0.006). 5. all vertical surfaces 5? typical draft. s d 8 pl g 4 5 8 1 s b m 0.25 (0.010) a t -a- -b- n s mpxv7007g sensors 6 freescale semiconductor case 482a-01 issue a small outline package
package dimensions mpxv7007g sensors freescale semiconductor 7 notes: 1. 2. 3. 4. controlling dimension: inch. interpret dimensions and tolerances per asme y14.5m, 1994. dimensions "d" and "e1" do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.008 (0.203) maximum. n a c 0.004 (0.1) detail g seating plane 8x p d e e/2 e a m 0.004 (0.1) b c e1 a b a 0.006 (0.15) b c 8x b 2 places 4 tips 1 4 8 5 f min max min max millimeters inches 0.370 0.390 9.39 9.91 0.002 0.010 0.05 0.25 0.038 0.042 0.96 1.07 0.465 0.485 11.81 12.32 0.680 0.700 17.27 17.78 0.465 0.485 11.81 12.32 0.270 0.290 6.86 7.37 0.160 0.180 4.06 4.57 0.009 0.011 0.23 0.28 0.110 0.130 2.79 3.30 0.100 bsc 2.54 bsc 0.240 0.260 6.10 6.60 0.115 0.135 2.92 3.43 0.040 0.060 1.02 1.52 0? 7? 0? 7? dim a a1 b d e e1 e m n p t f k l k m t ? gage plane detail g l a1 .014 (0.35) style 1: pin 1. gnd 2. +vout 3. vs 4. -vout 5. n/c 6. n/c 7. n/c 8. n/c style 2: pin 1. n/c 2. vs 3. gnd 4. vout 5. n/c 6. n/c 7. n/c 8. n/c case 1351-01 issue o small outline package
package dimensions notes: 1. 2. 3. 4. controlling dimension: inch. interpret dimensions and tolerances per asme y14.5m, 1994. dimensions "d" and "e1" do not include mold flash or protrusions. mold flash or protrusions shall not exceed 0.006 (0.152) per side. dimension "b" does not include dambar protrusion. allowable dambar protrusion shall be 0.008 (0.203) maximum. n a c 0.004 (0.1) detail g seating plane 8x p t ? d e e/2 e a m 0.004 (0.1) b c e1 a b a 0.008 (0.20) b c 8x b 2 places 4 tips 1 4 8 5 f dim min max min max millimeters inches a 0.300 0.330 7.11 7.62 a1 0.002 0.010 0.05 0.25 b 0.038 0.042 0.96 1.07 d 0.465 0.485 11.81 12.32 e e1 0.465 0.485 11.81 12.32 e m 0.270 0.290 6.86 7.36 n 0.080 0.090 2.03 2.28 p 0.009 0.011 0.23 0.28 t 0.115 0.125 2.92 3.17 0.100 bsc 2.54 bsc f 0.245 0.255 6.22 6.47 k 0.120 0.130 3.05 3.30 l 0.061 0.071 1.55 1.80 0? 7? 0? 7? 0.717 bsc 18.21 bsc k m gage plane detail g l a1 .014 (0.35) case 1369-01 issue o small outline package mpxv7007g sensors 8 freescale semiconductor
mpxv7007g sensors freescale semiconductor 9 notes
mpxv7007g sensors 10 freescale semiconductor notes
mpxv7007g sensors freescale semiconductor 11 notes
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